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ieee.org
Deep Pitch Scaling of Wafer-to-wafer and Die-to-wafer Cu/SiCN Hybrid Bonding
(25:32 Q&A) Dr. Anne Jourdain, imecFrom the First IEEE Hybrid Bonding Symposium Summary: Hybrid bonding is recognized as the key technology for advanced heterogeneous wafer-level system integration. This is enabled through aggressive pad size and 3D interconnect pitch scaling, resulting in minimal electrical die-to-die interconnect delay. In ...
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